A Call for Presentations

THE FOURTEENTH MEETING OF
THE SYMPOSIUM ON POLYMERS
FOR MICROELECTRONICS

May 11-13, 2010

Winterthur Museum & Gardens
Wilmington, Delaware
Sponsored by

Dedication

The fourteenth meeting of the Symposium on Polymers is dedicated to the memory of symposium founder and chairman, Craig C. Schuckert.


The thirteenth meeting of the Symposium on Polymers will be held on May 11th, 12th and 13th of 2010. The Symposium on Polymers has grown to become one of the most comprehensive technical meetings related to the processing and implementation of polyimides and new polymeric films for advanced microelectronic applications. This meeting is sponsored by HD MicroSystems LLC, The Electrochemical Society, FUJIFILM Electronic Materials U.S.A., Inc., JSR Micro, Inc., and Dow Electronic Materials.

The Symposium on Polymers is held on the grounds of the Winterthur Museum and Gardens in the outlying countryside of Wilmington, Delaware. This picturesque setting of rolling hills and forests provides a relaxed, intimate setting for the meeting. The main symposium sessions will be held in the Copeland Lecture Hall in a workshop-like format. As with prior meetings, ample time will be allotted during breaks and lunch for informal discussions. The symposium poster session, exhibits and a formal dinner for all participants will be held at the DuPont Country Club in nearby Rockland, Delaware.

The program board is soliciting presentations in the following technology areas:

  • Integration of New Polymeric Materials in Microelectronics
  • Processing of Polymer Thin Films
  • New Polymer Materials Technology
  • Structure Property Relationships and Modeling of Polymeric Materials
  • New Polymer Applications

Program Chairs – Business Committee
Bill Motsiff, William Motsiff Consulting
John Malloy, HD Microsystems
Sue Bagen, Endicott Interconnect
Gene Garret, Raytheon 		Program Co-Chairs – Technical Committee
Mike Goodner, Intel
Tim Daubenspeck, IBM
Program Administrator
Diane Barcheski, HD Microsystems

Board of Directors
Susan Bagen, Endicott Interconnect
Sue Ann Bidstrup Allen, Georgia Institute of Technology
Jack Craig, HD Microsystems, retired
Tim Daubenspeck, IBM ♦ Kevin Durocher, GE ♦ Tim Fest, The Electrochemical Society
Gene Garrett, Raytheon ♦ Mike Goodner, Intel ♦ John Malloy, HD MicroSystems
Walt Marcinkiewicz, Sony Ericcson Mobile Communications.
Bill Motsiff, William Motsiff Consulting
Joel Plawsky, Rensselaer Polytechnic ♦ Ed Prack, Intel ♦ Yoshiro Shimizu, JSR Micro
Suzanne Redding, Dow Electronic Materials ♦ Hank Seiler, HD MicroSystems, retired
Bill Weber, FujiFilm Electronics, U.S.A., Inc. ♦ Robb White, SAIC


The Symposium on Polymers
for Microelectronics at Winterthur

The Symposium on Polymers has been held every 2 years since it was first established in 1988. The Charter has remained the same: To provide an intimate forum for the exchange of technical information and innovations for the use of thin-film polymeric materials in contemporary microelectronic and new application areas, with a strong emphasis on processing. The Technical Program Board is pleased to announce the following keynote speakers and topics to be presented at the symposium:


KEYNOTE ADDRESSES

"Healthcare Roadmap"
Bill Burdick, GE

"Chip Package Interaction"
Dr. Jon Casey, IBM

"Direction of Microelectronics in Chip Packaging Technology"
Eric Beyne, IMEC



As a recognized technology leader, we invite you to submit a title and abstract for one of the topic areas listed below.

Buffer Coating Applications
Wafer-Level Passivation
Polyimide and Alternative Polymer Passivation
Redistribution Layers

Front-End of Line Applications
(device through passivation)
Semiconductor Applications, CMP Pads
Low K Dielectric Materials
Anti-Reflective Coatings, Sacrificial Materials

Back-End of Line Applications
(passivation through die packaging)
Wafer Bumping
Underfill and Epoxy Molding Compounds
Die Attach, Adhesive & Thermal Interface Materials
Chip Scale & Wafer Scale Packaging
Multi-Chip Packaging Applications SiP and SoP
3D Packaging

Structure-Property Relationships & Characterization
Synthesis, Applications, Modification & Tailoring
Polymeric Characterization & Testing
Molecular Modeling

Emerging & Novel Applications
Biomedical Applications
Sensors / MEMs / Microfluidics
Conductive and Ferroelectric Polymers
Optoelectronic Packaging & Waveguides
New Processing & Metrology Techniques
Embedded & Integral Passives, Embedded Actives
Display Technologies
Flexible, transparent, printable, organic electronics
Photovoltaics

Interactive Poster Session and Exhibition
Specialty Topics
New Advances in Related Technology



A proceedings volume CD ROM will be produced and mailed to all symposium participants after the event. It will be comprised of all featured talks, including the poster session. Presentations for publication may be submitted in either manuscript or presentation form. No photography or recording is permitted during the symposium presentations or poster sessions.


Abstract Submission

To Submit a Title & Abstract:
Abstracts of 150 word minimum up to 1 page in length are due by January 31, 2010. Please provide the Abstract in MS Word or other compatible format than can be edited. Please do not submit a file in PDF format.

Submit Abstract On-Line

Those interested in exhibiting and/or sponsorship should contact Diane Barcheski
(diane.m.barcheski@usa.dupont.com).

For further information please visit the web site.
www.symposiumonpolymers.com