Susan Bagen | Leo Linehan | |||
| Endicott Interconnect | Dow Electronic Materials - Advanced Packaging Tech | |||
Diane Barcheski | Sanjay Malik | |||
| HDM | Fujfilm Electronic Materials U.S.A., Inc. | |||
Sue Ann Bidstrup-Allen | John Malloy | |||
| Georgia Tech | HDM | |||
Jack Craig | Bill Motsiff | |||
| PIconsul, Inc. | William Motsiff Consulting | |||
Tim Daubenspeck | Laurinda Ng | |||
| IBM | TriQuint Semiconductor | |||
Kevin Durocher | Joel Plawsky | |||
| GE | Rensselaer Polytechnic | |||
Susan Eshelman | Ed Prack | |||
| Raytheon | Intel | |||
Tim Fest | Hank Seiler | |||
| Electrochemical Society | HDM retired | |||
Mike Goodner | Yoshihiro Shimizu | |||
| Intel | JSR Micro | |||
Eric Johnson | Robb White | |||
| JSR Micro | SAIC | |||