The Symposium on
Polymers for Microelectronics
14th Meeting Agenda
May 11-13, 2010
|
Tuesday |
Session 1 -
Wafer and Embedded IC Packaging |
|
8:30
- 8:35 |
Welcome; Symposium Opening Remarks |
|
8:35
- 9:20 |
Chip
Package Interaction; Jon Casey, IBM Systems and Technology Group, East |
|
9:20
- 9:45 |
Impact of Chip-Packaging Interaction on
Interfacial Cracking of Multilevel Cu/Low-k Interconnect Structures; Paul Ho;
|
|
9:45
- 10:10 |
Chip-Package Interaction (CPI) and Chip Level
Final Via Design; Timothy Daubenspeck; IBM, |
|
10:10
- 10:35 |
Polymer Requirements for Advanced Wafer Level
Packaging; John Hunt; ASE, |
|
10:35
- 11:00 |
Break |
|
11:00
- 11:25 |
Polymer Nanocomposite
Based Embedded Passives: Towards System in Package (SiP);
Rabindra N. Das; Endicott Interconnect
Technologies, Inc., |
|
11:25
- 11:50 |
Development of a Low Temperature Curing - Aqueous
Base Developable Photoimageable Dielectric for WLP
(Wafer Level Packaging) Applications; Michael Gallagher; Dow Electronic
Materials, |
|
11:50
- 12:15 |
Reduced Moisture Uptake and Moisture Expansion Polyimides; Garrett D Poe; NeXolve |
|
12:15
- 1:30 |
Lunch |
|
1:30
- 1:55 |
Ultra Low Temperature Curable Positive Tone Photodefineable Polybenzoxazole
; Tomonori Minegishi, Yamazaki R&D Center, HD Microsystems, Ltd and
Hitachi Chemical Co. |
|
1:55
- 2:20 |
Design of Novel Positive Tone Photosenstive
Polyimide with High Sensitivity and Accurate Pattern Fidelity; Masao Tomikawa;
Toray Industries |
|
2:20
- 2:45 |
Cross-linking of Aqueous-Base Developable
Photosensitive Polynorbornene; Mehrsa
Raeis-Zadeh; Georgia Institute of Technology |
|
2:45
- 3:10 |
Break |
|
3:10
- 3:35 |
Ultra Low Temperature Curable Positive Tone Photodefineable Polybenzoxazole
- II; Noritaka Matsuie,
Yamazaki R&D Center, HD Microsystems, Ltd and Hitachi Chemical Co. |
|
3:35
- 4:00 |
Underfill
Material and Process Solution for Large Ultra Low K Flip Chip Encapsulaton; Marie- Claude.Paquet;
IBM Bromont, |
|
4:00
- 4:25 |
Reduced Warpage and
Stress in Polymer Films for Microelectronics; Robert Hubbard; Lambda
Technologies, Henkel Corporation, Department of Chemistry, |
|
|
|
|
5:30
- 7:00 |
Symposium Reception - Reflecting Pool |
|
|
|
|
Wednesday |
Session 2 - 3D/TSV/Novel Apps |
|
8:30
- 8:35 |
Direction of Microelectronics in Chip Packaging
Technology; Eric Beyne; ; IMEC, |
|
8:35
- 9:20 |
Integration of Thinned Silicon Chips int a Polymer-Copper- Redistribution- A- 3-D Stacking
Technology without TSVs; Tobias Baumgartner; Fraunhofer IZM |
|
9:20
- 9:45 |
Evaluation of Photosenstive
Spin-On Dielectrics for 3-D Wafer Level Packaging; F. Duval; ; IMEC, |
|
9:45
- 10:10 |
Coaxial Through Silicon Via for 3D Applications
with Polyimide Dielectric; Richard Volant, IBM East |
|
10:10
- 10:35 |
Break |
|
10:35
- 11:00 |
Electrografted
Polymer Layers for Insulation of Deep TSV Structures; V. Mevellec;
Alchimer SA |
|
11:00
- 11:25 |
Implementation of 3D Lithography for wafer Level
Through Silicon Via (TSV) Applications; |
|
11:25
- 11:50 |
Temporary Wafer to Wafer bonding for 3D
Integration using Polyimide Coatings; K.Koschke, Fraunhofer Institute, Berlin, GE |
|
11:50
- 12:15 |
Lunch |
|
12:15
- 1:30 |
Fabrication and Packaging of a Backside Contact,
High Voltage Photovoltaic Device; Thomas Gorczyca;
General Electric |
|
1:30
- 1:55 |
Wafer Level Via Filling and Interconnection Using
Conductive Polymer by Screen Printing; Damien Saint ¨CPatrice; CEA |
|
1:55
- 2:20 |
Organic Optoelectronic Devices-Flexibility Versus
Performance; Matt Aldissi; Universite
de Limoges/CNRS, Fractal Systems |
|
2:20
- 2:45 |
Novel Organosiloxane
Polymers with Improved Device Properties; Edward W. Rutter,
Jr.; Honeywell Electronic Materials |
|
2:45
- 3:10 |
Break |
|
|
Session 3 - Electronic Materials and Methods |
|
3:10
- 3:35 |
Thermal Contact Materials Requirements for
Testing of Electronic Packages; ; Ashish Gupta;
Intel Corporation |
|
3:35
- 4:00 |
Using High Temperature Thermal Conductivity to
Assess Reliability Performance of Epoxy Mold Compounds; Sheila Liza B. Dal; On Semiconductor Phillipines
Inc |
|
4:00
- 4:25 |
Printed Electronics-Fading into Reality; Donald
Hayes; MicroFab Technologies, Inc. |
|
4:25
- 4:50 |
Polymer Process Optimization Made Easy; Clifford
J. Hamel, SUSS MicroTec, Inc. |
|
|
|
|
6:00
- 9:30 |
Exhibitors/Cocktails/ Dinner |
|
|
|
|
Thursday |
Session 3 - Electronic Materials and Methods |
|
8:00
- 8:45 |
Health Care Roadmap; Bill Burdick General Electric |
|
8:45
- 9:10 |
Flexible Isotropically
Conductive Adhesives with High Reliability and Mild Curing Condition; Dr.
Cheng Yang; Department of Mechanical Engineering, The Hong Kong University of
Science and Technology |
|
9:10
- 9:35 |
Achieving Ceramic-like RF Capacitors Requirements
with Organic based Materials; ; Jin-Hyun Hwang; Oak-Mitsui Technologies, LLC |
|
9:35
- 10:00 |
Advanced Rework Solutions for Delectric
Film Removal in Semiconductor Manufacturing Processes; Michael Phenis;
Dynalloy |
|
10:00
- 10:25 |
Break |
|
10:25
- 10:50 |
Preventing Reliability and Yield Degradations
Caused by Bubble Defects; J. Braggin; Entegris |
|
10:50
- 11:15 |
High Speed Shear Testing of WLCSP Solder Alloys,
and the Correlation to JEDEC Board Drop Testing; Andrew J. Schoenberg; Fairchild |
|
11:15
- 11:40 |
Packaging Requirements for Flexible CIGS; Todd
Tolliver; GE Research |